DDP Specialty Products, we represent, offers portfolio of materials that deliver enabling technology for leading-edge packaging schemes, such as WLCSP, Flip Chip, SiP and 3D chip package. DDP offers a wide range of polymer materials, including dry-tech and photo-imageable dielectrics, positive RDL photoresists, negative bump resists and all the necessary ancillaries for processing them. Our customers range from semiconductor, electronic industry to research development institute. As for geography area, we offer service to the customers in Taiwan and Great China. As for the quality of delivery of the materials, we are pursuing the safety policy of DDP. We assure our customers for highest standard of operation procedure to make sure the products delivered to our customerssafely and in time.
